Intel Lakefield Brings Its 3D Chip-Stacking Tech to Life Ifeadi C. 00:12 Feed: All Latest, Zero Tech Blog Weeks after introducing Foveros, its 3D logic stacking technology, Intel has shown off a motherboard that puts it to use. via Zero Tech Blog Share this Share on FacebookTweet on TwitterPlus on Google+ Related PostsDarth Vader and Elvis spotted on the International Space StationSamsung's Secret MessageShoutout to the 5-year-old who grew out her hair for this 'Harry Potter' Halloween costumeVenice's worst flood in 10 years couldn't stop this restaurant from serving pizzaYou can now pay just £1.60 for CyberGhost VPN with this exclusive dealThis bike path paves the way for future roads made from recycled plastic — Genius Moments